Sytems Engineer II (Telematics HW/RF Engineer)

About DENSO

DENSO is one of the largest global automotive suppliers of advanced technology, systems and components in the areas of thermal, powertrain control, electronics and information and safety. From automated driving to hybrid and electric vehicle components, we’re crafting the core technologies of modern mobility. We draw on the strengths of individual inventors who are joining together to become an unstoppable force for global good. With our North American headquarters located in Michigan, DENSO employs more than 24,000 people at 28 consolidated subsidiaries and 4 affiliates across the North American region. Worldwide, the company has more than 200 subsidiaries and affiliates in 38 countries and regions and employs more than 170,000 people. Consolidated global sales for the fiscal year ending March 31, 2018, totaled US$48.1 billion.

The selected individual will involve DENSO electronic hardware development with such responsibilities as: module suppliers and by module evaluation for the next generation product in automotive industry. Analyze and adhere to internal and external specs, requirements, regulations, and industry standards.

Prototype Hardware Stage:

  • Collaborate with DENSO Japan (GHQ) HW designers.
  • Complete the schematics design and other relevant drawings based on early stage design
  • Create product testing requirements, analyze the results, and improve the design
  • Work with PCB designers to optimize layout to meet internal and external Electrical requirements

Prototype Leading to Mass Production:

  • Understanding of internal and customer's standards regarding design and reliability
  • Design to strike a balance among specification and cost
  • Prepare design review for internal and external gate event
  • Develop product DFMEA and/or DRBFM and other engineering specific information
  • Work with manufacturing plant to develop comprehensive test plan
  • Monitor and report the progress of wireless communications module suppliers to meet performance/reliability/schedule requirements for mass production
  • Collaborate with DNJP HW designer based on current design
  • Bachelor or above degree preferably in Electrical Engineering or Computer Engineering
  • Basic knowledge of RF and wireless communication
  • Basic knowledge of electrical components and semi-conductor device
  • Basic knowledge of computer system
  • Experience of some experiment using basic electrical measuring equipment such as oscilloscope, spectrum analyzer, etc..........
  • No objection for months of business trip or working overseas to Japan in order to obtain mass production design skills throughout OJT.
Preferred Qualifications
  • 3-5 years of automotive hardware design experience
  • RF characteristics understanding and evaluation
  • Hardware design and evaluation skills related to cellular, wireless, LAN, Bluetooth LE and so on.....
  • Knowledge regarding 3GPP or wireless LAN standard
  • Knowledge related to Qualcomm Device, Platform, and their debugging tools
  • Knowledge related to high speed interface such as Ethernet, USB, PCle, SGMII and so on......
  • General knowledge related to BB device such as Application processor, RAM, Flesh Memory, and other peripheral devices
  • Knowledge related to high density mounting, such as device package, PCB, soldering material and so on......
  • Knowledge regarding RF component and system interoperability
  • PCB layout and artwork experience
  • Knowledge of antenna design
  • Strong RF design experience dealing with LTE module, antenna, etc......